Samsung may revive its Exynos processor in the Galaxy S26 Ultra, leveraging 2nm technology and custom SoC design to boost performance and hardware synergy.

AMD unveils EPYC 2005 embedded processors with Zen 5, 16 cores, DDR5, and PCIe Gen5, delivering high performance and compact design for edge AI and industrial devices.

TSMC is fast-tracking its Arizona advanced packaging plant as U.S. demand for CoWoS rises, aiming to support AI chip production and reduce overseas dependence.

Samsung is shifting DRAM capacity toward high-margin DDR5 RDIMM as prices jump, while easing its HBM expansion, reshaping global memory supply into 2026.

Intel confirms wafer shortages are limiting Lunar Lake and Arrow Lake AI PC chip shipments, highlighting supply bottlenecks and advanced-node capacity challenges.

If Google expands TPU availability, its AI chips could reshape the global market, strengthen cloud AI adoption, and offer an attractive alternative to traditional GPU solutions.

Meta plans to slash up to 30% of its metaverse budget, raising layoff concerns as it shifts focus toward AI investment and restructures Reality Labs.

Memory makers are prioritizing HBM production, tightening consumer DRAM and SSD supply and pushing next-generation PC prices up by at least 20% next year.

Marvell confirms a $3.25B acquisition of Celestial AI to accelerate photonic interconnects for AI and cloud data centers, with milestone-based earn-outs included.

NAND Flash prices surged in November as strong AI and enterprise SSD demand met tight wafer supply, pushing costs higher across multiple capacities and memory types.