October panel prices show 50-inch+ TV panels dropping $1–$2 due to slowing year-end demand and weak promotions, while IT and laptop panels remain mostly stable.

ASE Electronics plans to acquire 100% of ADI's Malaysia unit, aiming to boost supply chain resilience and support AI, automotive, and industrial electronics growth.

Samsung invests in two High NA EUV machines to strengthen 2nm foundry production, boost DRAM and HBM output, and support advanced AI-driven semiconductor chips.

According to reports, Micron accelerates 9nm DRAM development to compete with Samsung and SK Hynix, while next-gen 3D DRAM progress could shift industry timelines.

TSMC plans a US Giga Fab in Arizona to expand 2nm chip production, supporting growing AI, smartphone, and high-performance computing markets.

LG Display is reportedly planning to sell its Yantai LCD plant after profits plunged, signaling a deeper shift toward OLED and global business restructuring.

Samsung plans to disband its 1c DRAM yield team to focus on HBM4 mass production this year, aiming to meet NVIDIA’s next-gen memory demand efficiently.

MediaTek launches the Dimensity 9500 on TSMC 3nm, delivering major CPU, GPU, and NPU upgrades, advanced AI, 5G, and Wi-Fi 7 for next-gen smartphones.

Samsung and SK Hynix are accelerating new DRAM fab construction to meet surging AI-driven memory demand, sparking a potential "memory supercycle" through 2027.

Google is testing MediaTek's 5G-Advanced M90 for Pixel 11, aiming to improve performance, AI integration, and battery efficiency over Samsung Exynos.