UMC posted NT$20.04B in July 2025 revenue, down 4.1% YoY. While FX pressures persist, growth in 22/28nm nodes and Singapore fab expansion supports outlook.

Infineon beats Q3 estimates with 18% profit margin, raising full-year outlook as demand for automotive and AI chips offsets currency and tariff risks.

GlobalFoundries beats Q2 estimates but issues weak Q3 forecast, citing soft smartphone demand. Shares fall 9.34% as guidance disappoints investors.

Apple plans to adopt tandem OLED tech for iPhones by 2028, aiming for better power efficiency and improved display performance through advanced screen layering.

Ericsson is negotiating a multi-million dollar investment in Intel's NEX network business, strengthening their partnership in telecom chips and edge computing.

ASML's advanced EUV lithography systems are exempt from US tariffs, supporting cost-effective chip manufacturing for Intel, TSMC, and Samsung in the US market.

AMD may launch a dedicated NPU card to boost AI performance, reduce GPU load, and support generative AI and LLM inference on desktops and workstations.

Global CoWoS wafer demand will reach 1 million by 2026, with NVIDIA capturing 60% market share and TSMC leading advanced AI chip packaging capacity.

The EU plans to invest €30B in building a gigawatt-scale AI data center network to boost compute power and compete globally in artificial intelligence.

Apple is reportedly evaluating Intel's advanced 14A chip process, aiming to diversify M-series production amid geopolitical challenges and tech innovations.